According to the development of the domestic semiconductor lighting industry, the current domestic investment opportunities mainly come from the following aspects:
Access to and utilization of technology, patents and related talents; exploration and understanding of emerging and key markets; opportunities for industrial integration brought about by adjustment of domestic industrial structure; investment opportunities brought about by overseas industrial transfer.
1. Opportunities brought about by the development of new technologies As a technology-driven high-tech industry in the growth stage of the industrial development life cycle, the emergence and application of new technologies can always bring about breakthroughs in the industry, thus forming a new application market and also for investment. Come to many rare opportunities. According to the current technology research and development and future market demand for semiconductor lighting, it is most likely to make breakthroughs in the following technical fields, driving the industry into another wave of development climax.
Industrialization of MOCVD equipment; high-quality, low-cost SiC single crystal growth; epitaxial ultraviolet LED on sapphire substrate; GaN chip preparation on Si substrate; epitaxial and chip technology of new substrates such as GaN, LiAlO2, ZnO, AlN; GaN-based chip manufacturing; high-efficiency and high-power LED packaging technology; silicone materials for power LED packaging above 100lm/W; white light LED manufacturing technology for powers above 100lm/W; semiconductor lighting integration technology above 100lm/W; automotive headlamp system Integrated technology; indoor intelligent LED lighting system; large-size LCD backlight; power LED device lighting module development.
Among the above-listed technical directions, domestic research institutes have made breakthroughs in certain areas and brought good investment opportunities. Overseas technical teams, especially those with certain technical production experience, have returned to China to start businesses. Many technologies with independent intellectual property rights and mastering the global industrial development trend are ideal partners for domestic investors. In addition, with the integration of Taiwan's industry, the technical production departments of enterprises also change, some technologies The team or technical backbone left the company to start a business on its own or take another place, most of which have the mainland as the preferred target. These technical teams or backbones have a wealth of production experience and channels and are very good investment targets.
2. Market Discovery and Grasping In terms of market development, large investment opportunities are mainly focused on the exploration of emerging application areas and the grasp of key application areas.
As a new high-efficiency solid-state light source, semiconductor lighting has significant advantages such as long life, energy saving, environmental protection, safety and rich color. It will become another leap after the incandescent lamp and fluorescent lamp in the history of human lighting. At present, semiconductor lighting has formed a large industrial scale in applications such as backlight, automobile, landscape, architecture, signal and special lighting, and its development potential is also generally optimistic.
In addition, discovering new LED applications and commercial applications can bring many new investment opportunities. Especially in terms of energy saving, environmental protection, safety, etc., LED has many business opportunities to be explored.
As far as the current development trend of applied technologies and products is concerned, there will be large investment opportunities in the following market segments:
LCD backlight module; solar LED lamp; LED street lamp; LED car lamp; LED emergency lighting product; led display application; LED indoor commercial lighting.
3. Adjustment of domestic industrial structure With the formation of the domestic LED market scale and the gradual improvement of the industrial environment, the domestic industrial structure is in a period of adjustment. During this period, after years of development, domestic enterprise technology has formed a good accumulation, the production process has matured, and the market channels have been gradually rationalized, which will form a relatively high profit level. At the same time, these enterprises are also facing the pressure of rapid expansion of production scale, and the demand for funds is very urgent. For investors, it is also a very good investment choice to acquire or participate in more mature domestic enterprises and rapidly expand the scale of the industry and increase the profitability to achieve rich returns.
In addition, as the market competition intensifies, there will be cooperation and mergers and acquisitions between enterprises in the chip, packaging and application, and it also provides opportunities for investors who are trying to enter this industry and quickly occupy a certain market position.
4. Taiwan's industrial transfer is affected by cost pressures and market drivers. The trend of Taiwan LED companies shifting to the mainland is obvious. According to incomplete statistics, the production capacity of Taiwan's LED packaging manufacturers in the mainland has accounted for more than 60% of its total production capacity. Since 2006, the transfer of the epitaxial/chip industry has begun to increase rapidly. These industrial transfers have brought many investment and cooperation opportunities for domestic industrial development.
From the successful cases of Taiwanese industry transfer to the domestic market, most Taiwanese industries need to seek partners in capital and market in the Mainland, and bring industrial investment and development opportunities to enterprises with domestic resources such as capital and market applications. There are many advantages to working with Taiwan's mature companies on the mainland, such as the support of Taiwan's more mature technology and a wider market channel.
1.27mm (0.050") Pitch Female Headers
Like the 1.27mm pitch male header, the 1.27mm pitch female header is used in densely-packed devices, requiring space-saving connections. The low profile, 1.27mm pitch female header addresses the need for connecting a variety of board-to-board configurations, with vacuum pick and place that makes it suitable for high volume automated manufacturing. It can be available in varying elevated stack heights, pass-through, rugged, high-density, and in numerous low-cost designs.
Antenk offers 1.27mm pitch female headers in either SMT or THM orientation at high quality and affordable China-quoted price that snuggly fits with the pins of a male header and acts as a receptacle.
Assembly and service is simple with either vertical (straight), elevated or at a right angle orientation, which can dissipate current of about 1.0 A or less in a tape and reel packaging. The filleted corners can also remove shadowing allowing optimization of LED output.
The 1.27mm pitch female headers are commonly found in PC`s and are also made to work in Arduino boards, Arduino Pro and Arduino Mega with either single or double-row female headers, facilitating connections for programming and incorporation into other circuits. They have the perfect height for clearing the USB-B connector and great for stacking multiple shields.
Female header always called as [Header connector", Antenk provide widely range of header connector, from 2.54mm (.100″ inch) pitch to 1.0mm (.039″ inch) pitch. The number of pins (contacts) is from 2 to 40 pins per orw. There are three type: Straight (Dip Vertical), Right angle, SMT (surface mount).
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Applications of 1.27mm Pitch Female Headers
Its small size is most suitable for PCB connections of small equipment and devices such as:
Arduino Boards
Architectural and sign lighting
Retail and display lighting
Fluorescent LED retrofit lighting
Cabinet or furniture lighting
Commercial / residential cove lighting
WiFi equipment
Gaming consoles,
Measurement instruments
Medical Diagnostic and Monitoring equipment
Communications: Telecoms and Datacoms
Industrial and Automotive Control and Test
At one side of this female header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
1.27mm vertical single row female header, 1.27mm vertical dual row female header, 1.27mm Elevated single row female header, 1.27mm Elevated dual row female Header, 1.27mm right-angle single row female header and 1.27mm right-angle dual row female header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
1.27mm Right-angle Dual Row female header, 1.27mm SMT Single row female header, 1.27mm SMT Dual row female header and 1.27mm Elevated Dual Row female Header are Antenk`s SMT female headers.
Soldering Temperature for 1.27mm Pitch Female Headers
Soldering SMT female connectors can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Pin-Type: Vertical (Straight) and Right-Angle
1.27mm pitch female headers may be further classified into pin orientation as well, such as vertical or straight female header or right-angle male header.
Vertical or Straight Female Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Right-Angle Pin Female Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
PCB Connector Stacking
Profile Above PCB
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Elevated Sockets/Female Headers
Elevated Sockets aka Stacked sockets/receptacles or Mezzanine are simply stacked female headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
Choosing this type of stacking configuration promotes the following benefits:
Connector Isolation - the contacts are shrouded preventing cable connection mishaps and good guidance for the mating header connectors.
For off-the-shelf wireless PCB module, stacking height is optimized with elevated sockets.
Offers superior strength and rigidity.
Polarisation prevents users from inverted insertion.
Single, Dual or Multiple Number of Rows
For a 1.27mm straight or vertical female header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3 ,4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-40 pins while for dual row, the number contacts may vary from 2-80 pins.
Pin Material
The pins of the connector attached to the board have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Custom 1.27mm Pitch Female Headers
Customizable 1.27 mm pitch female headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
Tape and Reel Packaging for SMT Components
Antenk's SMT headers are offered with customizable mating pin lengths, in which each series has multiple number of of circuits, summing up to a thousand individual part number combinations per connector series.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
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ShenZhen Antenk Electronics Co,Ltd , https://www.antenkwire.com