As the market continues to grow, the demand for capacity and yield in the LED manufacturing industry is getting higher and higher. Laser processing technology has quickly become a common tool in the LED manufacturing industry, and has become an industry standard for high-brightness LED wafer processing.
Laser scribing of LED scribe lines is much narrower than conventional mechanical scribing, so material utilization is significantly improved, thus increasing output efficiency. In addition, laser processing is a non-contact process, which results in wafer microcracks and other damage, which results in tighter wafer granules, high output efficiency, high productivity, and high reliability of finished LED devices. improve.
Spectra-Physics industrial lasers have the advantages of high peak power and excellent beam quality, making them ideal for LED processing, bringing clean marking lines, higher throughput and higher brightness of finished LEDs to the LED industry.
The advantages of laser scribing
- Clean and tidy hard and brittle materials
- Non-contact process with low operating costs
- Reduce the occurrence of defects such as chipping, microcracking, and delamination
- The narrowing of the score line increases the number of splits on a single wafer
- Reduced microcracking improves long-term reliability of finished LED devices
- A wide range of processing tolerances make the process controllable and low cost and high reliability.
Second, LED laser characterization
Single crystal sapphire (Sapphire) and gallium nitride (GaN) are hard and brittle materials (tensile strength close to steel), so it is difficult to cut into individual LED devices. When cutting these materials with a conventional mechanical saw blade, it is easy to cause damage such as wafer chipping, microcracking, delamination, etc., so the LED wafer is cut with a saw blade, and a wide width must be reserved between the monomers to avoid cutting cracking. And LED devices, which greatly reduce the output efficiency of LED wafers.
Laser processing is non-contact processing. As an alternative to traditional mechanical saw blade cutting, the laser dicing slit is very small. The surface of the wafer after focusing laser light rapidly vaporizes the material and is very small between the active areas of the LED. The slits enable the cutting of more LED cells on a limited area of ​​wafer. Laser scribing is particularly good at gallium arsenide (GaAS) and other brittle compound semiconductor wafer materials. Laser processing of LED wafers, the typical scribe depth is 1/3 to 1/2 of the thickness of the substrate, so that a clean fracture surface can be obtained, and a narrow and deep laser scribe crack can be produced while ensuring high speed characterization speed. The laser is required to have excellent quality such as narrow pulse width, high beam quality, high peak power, and high repetition rate.
Not all lasers are suitable for LED scribing because of the transmission of the wafer material to visible wavelength lasers. GaN is transmissive for light with wavelengths less than 365 nm, while sapphire wafers are semi-transmissive for lasers with wavelengths greater than 177 nm, so three- and four-fold Q-switched all-solid-state lasers (DPSSL) with wavelengths of 355 nm and 266 nm are LED crystals. The best choice for round laser scribing. Although excimer lasers can also achieve the wavelengths required for LED scribing, multiplying all-solid-state Q-switched lasers are much smaller, much less maintenance than excimer lasers, and the full-solid laser scribing strips are very narrow in quality. Characterized by laser LED.
Laser scribing greatly reduces wafer microcracking and microcrack expansion, and the distance between LED cells is closer, which improves both production efficiency and productivity. In general, a 2-inch wafer can separate more than 20,000 LED individual devices. With such a high density, the slit width of the cut will significantly affect the number of splits, reducing microcracks after sorting. The long-term reliability of LED devices will also be significantly improved. Compared with the traditional blade cutting, the laser scribing not only improves the output efficiency, but also increases the processing speed, avoids the processing defects and cost loss caused by the blade wear, and the laser processing precision is high, the processing tolerance is large, and the cost is low.
Key market requirements for DPSS all solid state lasers
- High reliability
- Long continuous running time
- One-button open parameter optimized laser LED scribing process
--266nm full-solid laser for front marking of LED wafers
--355nm for back scribe
- Global service, technical support network
- Short pulse width and high peak power for deep scribe, minimizing thermal damage
- High quality beam quality for minimum scribe width
- Laser supplier has strong application development strength and experience
III. Overview of Spectra-Physics Lasers
Spectroscopic-physical has long been a global customer leader in the field of laser technology services. 50 years of development history spectroscopy - physical design, research and development, manufacturing a series of the world's first commercial lasers for the industrial market, including lasers for LED laser scribing.
In general, the laser marking advantages for LEDs are clear, but they also face many technical challenges, such as differences in materials, thicknesses, and scoring speeds of different cases. For this spectrum-physics, there are several series of laser products for laser scribing and granulating. It is the leader in industrial processing in this area. It is constantly introducing innovative high-precision lasers such as Tristar TM, Navigator TM, HIPPOTM and other series of high power. Nanosecond laser products, as well as the Vanguard TM series of picosecond lasers. If you need a femtosecond laser, Spectra-Physical SolsTIce? The laser is available in a 100fs fully automatic femtosecond pulsed laser. The product is designed for industrial applications and is rugged and reliable.
When the short-pulse high-peak power spectral-physical laser acts on the LED substrate, the effect is: the scribe line is clean, the material position is small, and the thermal damage to the substrate is very small. Spectra-physics provides you with deeper application knowledge and experience to help your process achieve optimal results.
Our technology, experience and innovative spirit make our lasers stand out. Spectro-physical solid-state lasers using ProLite? Diode pump sources have industry leadership and are twice as long as competitors. In addition, spectral-physical EternAlignTM optics loading technology ensures good optical alignment over and over the life of the laser.
Spectral-physical unique extra-cavity frequency doubling technology is the highest quality in all-solid Q lasers. In addition, key components of the laser such as pump diodes, fiber optics, shutters, output windows, etc. can be easily replaced in the field, which makes the spectrum-physical all-solid-state laser continuous running time and the mean time to repair (MTTR) doubled. Your use and maintenance costs will be the lowest. Every spectrum-physical laser supplied to you is backed by the confidence and assurance of the Newport Global Laser service to the technical support team.
Spectra-Physics Spectroscopy - The Advantages of Physical Lasers
- Long continuous working hours - from the high reliability of the product, excellent design and technical support
- Pump diode life - twice the average life of industrial laser pump diodes
- Technical support - Global technical support after-sales service network for high-quality installed capacity
- Market Validation - Thousands of installed spectrum-physical lasers demonstrate excellent laser performance in 24/7 industrial applications.
- Short pulse width - means higher peak power and minimized heat affected zone
- Nearly perfect beam quality - narrower scribe width
- Better pulse-pulse energy stability - for more precise scoring depth control
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