The LED package is formed by a die (die) through a wire bonding, eutectic or flip chip packaging technology and a heat sink substrate Submount (sub-adhesive technology) to form an LED chip , and then the chip is fixed on the system board and linked into a light source module.
At present, the LED packaging method can be roughly divided into a lens type (Lens-type) and a reflector type (Reflector-type), wherein the lens can be formed by molding or lens bonding; as shown in FIG. 1(a) The reflective cup chip is mostly formed by mixing, clicking, and packaging; as shown in Figure 1(b).
In recent years, epitaxial, solid crystal and package design have gradually matured. The grain size and structure of LEDs have been miniaturized year by year. The power of single crystals of high power is 1~3W, even more than 3W. When the LED power is continuously improved, for LED crystal The heat dissipation and heat resistance requirements of the particle-borne version and the system circuit board are becoming increasingly stringent.
Figure 1 (a
Figure 1 (b)
In view of the comprehensive considerations of insulation, pressure resistance, heat dissipation and heat resistance, ceramic substrates have become one of the important materials for the secondary adhesion technology. The technology can be divided into a thick film process (Thick film), a low temperature co-firing process (LTCC) and a thin film process (DPC). However, the thick film process and the low-temperature co-firing process use screen printing technology and high-temperature process sintering, which is prone to rough lines, inaccurate alignment, and shrinkage ratio. If the line is more and more sophisticated, high-power LED products , For LED products that require accurate eutectic or flip chip processes, thick-film and low-temperature co-fired ceramic substrates are gradually in use.
For this reason, the high heat dissipation coefficient thin film ceramic heat dissipation substrate is formed by sputtering, electric/chemical deposition, and yellow light lithography process, and has the characteristics of precise metal lines and stable material system, and is suitable for high power, small size, high brightness LEDs. The development trend has solved the stringent requirements for the resolution and accuracy of the metal substrate of the ceramic substrate in the eutectic/wrapping process. The thin film ceramic COB (Chip On Board) heat sink substrate can meet different lighting needs.
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