LED packaging is a research topic involving multidisciplinary (such as optics, thermals, mechanics, electricity, mechanics, materials, semiconductors, etc.). From a certain perspective, LED packaging is not only a manufacturing technology, but also a basic science. Good packaging requires understanding and application of physical properties such as thermal, optical, materials and process mechanics. Uninwell International BQ-6886 series conductive silver glue is an indispensable glue in IED production packaging. Its requirements for conductive silver glue are good electrical and thermal conductivity, high shear strength and strong adhesion. The following is a simple analysis of the Uninwell International BQ-6886 series of high-power LED thermal conductive silver paste.
As the world's leading brand of high-end electronic adhesives, Uninwell International is committed to "the high-end electronic bonding protection experts around you". Conductive silver paste, conductive silver paste, palladium silver paste, conductive gold paste, platinum conductive paste, palladium platinum silver paste, conductive copper paste, conductive aluminum paste, conductive nickel paste, conductive carbon paste, solar conductive paste developed by Uninwell International , sputtering target, lead-free solder paste, anisotropic conductive adhesive, Tuffy adhesive, UV adhesive, photoresist, conductive and thermal phase change material, underfill adhesive, patch red plastic and other series of electronic adhesives have high cost performance The company has 145 Fortune 500 customers worldwide. Uninwell International is the world's most complete line of conductive silver paste products, covering room temperature curing, low temperature curing, medium temperature curing, high temperature curing, UV curing, photolithography, low temperature sintering, medium temperature sintering, high temperature sintering and other curing methods.
Conductive silver glue is widely used in: PV solar modules, TP touch screens, RFID radio frequency identification electronic tags, automotive electronics, electronic paper, LED, TR, IC, PCB, FPC, CSP, FC, VFD, ITO, EL cold light, CMOS Module, LCM module, PFD flat panel display, LCD liquid crystal display, PDP plasma display, OLED organic electroluminescence display, membrane switch, keyboard, sensor, optoelectronic device, communication electronics, microwave communication, medical electronics, passive components, thick Membrane circuits, piezoelectric crystals, integrated circuits and other fields. The company's BQ-6886 series conductive silver paste is a high thermal conductivity type; it is suitable for high-end electronic adhesives for light-emitting diodes (LED), high-power high-brightness LEDs and other light-emitting devices.
As a global leader in conducting and conducting heat, Uninwell has a deep understanding of conduction and thermal conductivity. Based on the concept of thermal conductivity and electrical conductivity, the company is used in other industries, such as thermal conductivity design materials for (CPV concentrating solar cells). The overall solution for high-power LED heat dissipation and thermal conduction. Uninwell high-power LED heat and thermal materials mainly involve the following links:
1. The wafer PN is connected to the epitaxial layer;
2. an epitaxial layer to the package substrate;
3. Package the substrate to an external cooling unit and then to the air.
1. High-power LEDs use high thermal conductivity conductive silver paste to solve the problem of heat dissipation from the PN junction to the epitaxial layer of the wafer.
Uninwell International BQ-6886 Series High Power LED Conductive Silver Adhesive High thermal conductivity conductive silver adhesive has good electrical conductivity, strong shearing force, good rheology and low moisture absorption. Particularly suitable for high power and high brightness LED packages. The thermal conductivity of this high thermal conductivity silver paste is: 25.8 The shear strength is: 14.7, which is the best in the industry.
Display applications have long been the main appeal of LEDs. For LEDs where heat dissipation is not critical, LEDs are often packaged using conventional epoxy substrates. After 2000, with the development of LED high-luminance and high-efficiency technology, coupled with the significant improvement in the luminous efficiency of blue LEDs, and the continued decline in LED manufacturing costs, the scope of LED applications and the industry's willingness to adopt LEDs continue to expand. Including LCD, home appliances, automotive and other industries, we are also actively considering the possibility of applying LEDs. For example, consumers expect high-power LEDs to achieve power saving, high brightness, long life and high color reproducibility. This represents the ability to achieve high heat dissipation and is an indispensable condition for high power LED package substrates. In addition, LCD panel operators are facing the EU RoHS regulations, and it is necessary to face the environmental pressure of completely non-silvering of cold cathode lamps, which has made the market demand for high-power LEDs more urgent. In addition to protecting the internal LED chip, the LED package also has the functions of electrical connection and heat dissipation between the LED chip and the outside.
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