At present, the heat dissipation design of the LED package substrate is roughly divided into two parts: heat transfer from the LED chip to the package, and heat transfer from the package to the outside. When a high-heat conductive material is used, the temperature difference inside the package is reduced, and the heat flow is not locally concentrated. The heat flow generated by the LED chip flows radially to all corners of the package, so that the high heat conductive material can be used to improve the interior. Thermal diffusivity.
The metal high heat dissipation substrate material can be divided into two types of hard and flexible substrates. Structurally, the rigid substrate belongs to the traditional metal material, the metal LED package substrate is made of aluminum and copper, and the insulating layer is partially filled with a highly thermally conductive inorganic filler, which has high thermal conductivity, processability, electromagnetic wave shielding, and thermal shock resistance. Metal properties such as sex, thickness is usually greater than 1mm, most of them are widely used in LED luminaire modules, and lighting modules, etc., technically with the same high thermal conductivity of aluminum substrates, in high heat dissipation requirements, quite capable of high power LED packaging material.
The emergence of flexible substrates, which were originally expected to be developed for the thinning requirements of LCD backlight modules for car navigation, and the development of high-power LEDs for three-dimensional packaging requirements. The substantially flexible substrate is made of aluminum and is made of aluminum. The high thermal conductivity and lightweight properties make a high-density package substrate, and after being thinned through an aluminum substrate, it can achieve flexible properties and can also have high heat transfer characteristics. However, the metal package substrate has the disadvantage that the metal has a large thermal expansion coefficient and is easily affected by the thermal cycle when soldered to the low thermal expansion coefficient ceramic chip. Therefore, when the aluminum nitride package is used, the metal package substrate may be uncoordinated. It is necessary to overcome the difference in thermal stress caused by various thermal expansion coefficient materials in the LED and improve the reliability of the package substrate.
The high-heat-conducting flexure substrate is a metal foil adhered to the insulating layer. Although the basic structure is identical to that of the conventional flexural substrate, in the case of the insulating layer, the soft epoxy resin is used to fill the high thermal conductivity inorganic filler, so that it has 8W. /m‧K's high thermal conductivity, combined with soft flexibility, high heat transfer characteristics and high reliability. In addition, the flexible substrate can also be designed as a single-sided double layer according to customer requirements. Double-sided double-layer structure. According to the experimental results, when the high heat conduction deflection substrate is used, the temperature of the LED is reduced by about 100 degrees Celsius, which represents a problem that the temperature of the LED is degraded, which can be greatly improved by changing the substrate design.
The high heat conduction flexure substrate can be used not only for high power LEDs, but also for other high power semiconductor components, suitable for environments with limited space or high density packaging. However, relying solely on the package substrate often fails to meet the actual needs, so the cooperation of the peripheral materials of the substrate also becomes important.
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