Today, the tools are in place, and there is no need for them to plant the ball on the opponent’s BGA256 FPGA chip.
The chip was purchased with balls, but after soldering, due to circuit board failure or soldering problems, the chip needs to be removed, resulting in loss of the ball and the need to replant the ball.
Generally, the ball planting is to get rid of all the balls and replant the balls. Since there is no steel mesh this time, the planting balls are all placed by hand.
The reference steps are as follows:
1. BGA chip
EP1K100FC256-3N
Package: BGA256 (16*16) 1mm pitch
Pad size: 0.55mm (the size of the selected ball is also 0.55mm)
2. Use the BGA tool table to fix the chip
1. First use a soldering iron to clean the excess tin of the chip's pad (old iron + suction tape). Note that the temperature should not be too high, about 350 degrees.
2. Apply solder paste (used to attach solder balls to facilitate placement of solder balls)
3. Place the solder balls one by one, so that each solder ball is on the pad (need to use more pointed tweezers)
Third, the effect after the placement is completed
1. Remove excess solder balls to avoid interference
2. Prepare to heat the hot air table (large caliber to help heat, low wind, high heat) 350 degrees
Four, heating and melting
1. The wind must be small, the tin balls will blow away if the weight is heavy, and the tin balls will be grouped together if they are light.
2. The temperature must be suitable (too high a chip breaks, too low a solder ball to melt)
3. The solder paste can be applied intermittently to make the ball planting stable and reliable. You must wait for the heating temperature to drop down almost before adding it, otherwise, the solder ball will be completely dried and the result will be lost.
4. Natural cooling, do not use a hair dryer to dissipate heat.
Five, complete the ball planting
1. Ball planting is not easy. Sometimes it is not successful at one time. For some unsuccessful solder balls, repeat the above process until all the solder balls are woven.
2. Because the solder paste is added in the ball planting process, after the completion, the pad will have impurities that will affect the appearance. The comrades with cleanliness will definitely not be able to bear it. You can use alcohol + ultrasonic cleaning
6. Comparison between the new IC and the old IC after planting the ball
Hand planting the ball, the success rate is low, the efficiency is low.
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